Qualcomm: Snapdragon 700 & 600 as 5G Chips for mid-range Smartphones

Even in 2019, Qualcomm wants to provide its partners with more favorable 5G-Snapdragons, the first devices should appear in 2020. The Chips have built-in 5G Modems and are manufactured with a 7-nm technology.

Qualcomm: Snapdragon 700 & 600 kommen als 5G-Chips für Mittelklasse-Smartphones

(c) Qualcomm

Qualcomm has made on the electronics trade show Ifa in 2019, cheaper Snapdragon SoCs with built in 5G Modem in view: The Snapdragon 700 and the Snapdragon 600 to put 2020 in middle-class Smartphones, because current system-on-a-Chip such as the Snapdragon 855 are meant for expensive High-End devices and the need for 5G, a dedicated Modem, which costs additional money.

The Snapdragon 700 and the Snapdragon 600, however, integrate the 5G Modem, the same will apply to the Snapdragon 865, the Qualcomm is still in 2019 wants to introduce. At least a Snapdragon 700 is to be announced by the end of the year, the SoC is produced by Qualcomm, according to a 7-nm process. The American manufacturer entered into a collaboration with Samsung Foundry for 5G Chips, which is why the 7LPP method with EUV exposure is likely.

First Smartphone with SD600/700 by 2020

Because Partner as of the end of 2019 the access to the Snapdragon 700, you want to appear first Smartphones to 2020 – the Mobile World Congress in February would be a typical date for announcements. At what time is the Snapdragon 600 with 5G Modem will be delivered, left Qualcomm open for the time being. You are likely to be in 2020, as 5G only wider need to establish. Other manufacturers have SoCs with built-in 5G-featured modem.

From Samsung the Exynos 980, which is different than the Exynos 9825 without 5G Modem, not a High-End Chip. Samsung uses its SoCs almost exclusively for its own devices, the same is true for Huawei: The Chinese have developed with the Kirin 990 a quick 5G-SoC (and at IFA 2019 presented), which is produced by TSMC using the latest N7+ referred to in the TEU Node.

Leave a Reply