7-Nanometer technology, a Frankenstein-CPU core, for the first time, a dedicated AI Hardware, and a 5G Modem With the Snapdragon 855 Qualcomm Chip, the plug in 2019, Top-Smartphones is presented.
When it comes to demonstrate 4K Videos with HDR10+, then Maui is suitable definitely: once Again, Qualcomm has held the annual Tech Summit on the Hawaiian island and that is where the Snapdragon 855 presented. The System-on-a-Chip (SoC) follows on from the previous Snapdragon 845 and should beat these in almost any metrics. Who buys 2019, a topsmart phone from Apple, or Huawei, receives a SoC, which allows for many interesting innovations. An Overview.
Purely from the Package, the Snapdragon 855 and 845 to give a little, both are good, one square centimeter in size, but not Pin-compatible. The new Chip has dropped Qualcomm from the long-term manufacturing partner Samsung, instead of the Snapdragon 855 is manufactured at TSMC, the world’s largest Foundry,. The 7-nm process uses no ultra-violet radiation, but immersion lithography. A comparison to Samsung 10LPP shows that with TSMCs N7, a smaller Chip is possible to use higher frequencies, however, hardly.
As usual, the SoC from different function blocks, a more important, however, is external: The Snapdragon 855 supports 4G – 5G mobile and wireless communications, when combined with the Snapdragon X50 referred to a Modem via two PCIe Lanes. The 10 nm of Samsung produced Baseband is not required for the processor alone, it is capable of running. The challenge for a manufacturer such as Samsung is to install the Chip and the matching of antennas and RF modules. Via 5G-NR (New Radio) should be up to 5 GBit/s are possible, the regular Snapdragon-X24-Modem with up to seven aggregated carriers in the Snapdragon 855 provides 2 GBit/s in the Downstream. Moreover, 802.11 ax alias Wifi6 is integrated, 802.11 ay with 60 GHz it takes is a Chip of your own.
Eight CPU cores
The eight CPU-cores Qualcomm referred to as cryo 485, overall, they are 45 percent faster than the Octacore processor of the Snapdragon 845. The Americans use a modified Cortex-A76, wherein, according to the licensor ARM are already 35% faster than the adapted Cortex-A75 in the Snapdragon 845. The remainder of the increase in performance achieved Qualcomm by, among other things, greater Out-of-Order window, optimized data paths, multi-cycle, additional Cache and higher memory frequency of LPDDR4X-2133 128-Bit. New is the so-called Prime-Core is.
|Snapdragon 845||Snapdragon 855|
|The manufacturing process||Samsung 10LPP||TSMC N7|
|CPU-µArchitektur||A75+A55 (modified)||A76+A55 (modified)|
|Graphics unit||Adreno 630||Adreno 640|
|L3/System-Cache||2 MB + 3 MB||2 MB + 3 MB|
|Interface||4x 16-Bit||4x 16-Bit|
|LTE/5G-Modem||Snapdragon X20||Snapdragon X24 + X50|
He is in the Gold Cluster, curiously, 512 KByte L2, and is clocked at up to 2.84 GHz and the other three run, with the maximum of 2.42 GHz and only have 256 KB. Although he has more tact, is not the Prime Core in a separate Power domain. The Silver-Cluster comprises four revised Cortex-A55 with up to 1.8 GHz, and these are also considered to be Block off. The configuration as a 1+3+4 to have advantages when Loading Apps and web pages, although just in the Prime Core requires relatively much energy. Both clusters have access to 2 MB of L3 Cache and 3 MB of System Cache; there are no Changes to the Snapdragon 845.
In the graphics unit, the Adreno 640, maintains Qualcomm the basic architecture. However, the manufacturer has increased the number of computing units (FP32/FP16 ALUs) to be equal to 50 percent, with a similar maximum stroke, the is named common-in order to thus increase the power by 20 percent. In the face of 7 nanometers, and the ALUMINUM-lot of this speed increase low, Qualcomm stressed, however, that it is an average and depending on the application or game would fail. New is the support for volcano v1.1, this should be done in the medium term for the entire Adreno-600 series, and HDR/10-Bit Gaming.